Microsoft says this new cooling method could enable more powerful chips and efficient data centers
Microsoft is developing a new cooling method called microfluidics that could enable more powerful and energy-efficient data centers. The method involves etching grooves onto the back of a microchip, allowing coolant to flow directly through the silicon. Microsoft's lab tests have shown that this microfluidic cooling system can remove heat up to three times better than the cold plates currently used in data centers. The company has successfully developed a microfluidic cooling system for a server running core services for a simulated Microsoft Teams meeting. If this technology can be successfully implemented outside of the lab, it could significantly reduce the amount of energy required to cool data centers, potentially leading to more efficient and environmentally-friendly data infrastructure in the future.
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